ABOUT

I am a graduate student at Interaction laboratory, POSTECH, South Korea. I am interested in haptics, human‑computer interaction (HCI), and VR/AR. My research goal is to present immersive haptic experiences to users through designing haptic hardware and rendering method.

Specifically, I focus on designing HAPTIC RENDERING METHOD for realistic and immersive haptic sensations through multimodality haptic rendering, HAPTIC INTERACTION & TECHNOLOGY for the hand‑held haptic controller by evaluating perceptual studies, and SENSING TECHNIQUES to identify information of material properties or human body.

CV Google Scholar

LATEST NEWS

Jan. 2024 | Chaeyong won the gold prize in the 4st POSTECH research performance contest
Jan. 2024 | A paper has been conditionally accepted for CHI 2024
Apr. 2023 | Three papers have been accepted for World Haptics Conference (WHC) 2023
Feb. 2023 | A paper has been accepted for CHI 2023 Honorable Mention Award
Jan. 2023 | A paper has been accepted for Advanced Optical Materials

RESEARCH OVERVIEW

SELECTED PUBLICATIONS

Augmenting Perceived Length of Handheld Controllers: Effects of Object Handle Properties
Chaeyong Park and Seungmoon Choi.
In Proceedings of the ACM conference on Human Factors in Computing Systems (Hawai'i, USA, May 11-16, 2024). CHI’24. ACM
Perceptual Simultaneity Between Vibrotactile and Impact Stimuli
Chaeyong Park and Seungmoon Choi.
In Proceedings of the IEEE World Haptics Conference (Delft, Netherlands, July 10-13, 2023). WHC’23. IEEE.
Visuo-haptic Crossmodal Shape Perception Model for Shape-Changing Handheld Controllers Bridged by Inertial Tensor ( Honorable Mention Award)
Chaeyong Park, Jeongwoo Kim, and Seungmoon Choi.
In Proceedings of the ACM conference on Human Factors in Computing Systems (Hamburg, Germany, April 23-28, 2023). CHI’23. ACM
Intrinsically Synchronized Flexible Visuo-Haptic Device Operated by Single External Electric Field
Gilwoon Lee*, Chaeyong Park*, Doowon Park, Seungmoon Choi, and Unyong Jeong. (*equal contribution)
In Advanced Optical Materials. vol. 11, no. 7, 2202515. 2023 (IF=10.050)