ABOUT

I am a graduate student at Interaction laboratory, POSTECH, South Korea. I am interested in haptics, human‑computer interaction (HCI), and VR/AR. My research goal is to present immersive haptic experiences to users through designing haptic hardware and rendering method.

Specifically, I focus on designing HAPTIC RENDERING METHOD for realistic and immersive haptic sensations through multimodality haptic rendering, HAPTIC INTERACTION & TECHNOLOGY for the hand‑held haptic controller by evaluating perceptual studies, and SENSING TECHNIQUES to identify information of material properties or human body.

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LATEST NEWS

Apr. 2023 | Three papers have been accepted for World Haptics Conference (WHC) 2023
Feb. 2023 | A paper has been accepted for CHI 2023 Honorable Mention Award
Jan. 2023 | A paper has been accepted for Advanced Optical Materials
Jan. 2022 | A paper has been accepted for CHI 2022

RESEARCH OVERVIEW

SELECTED PUBLICATIONS

Perceptual Simultaneity Between Vibrotactile and Impact Stimuli
Chaeyong Park and Seungmoon Choi.
In Proceedings of the IEEE World Haptics Conference (Delft, Netherlands, July 10-13, 2023). WHC’23. IEEE. (Accepted)
Visuo-haptic Crossmodal Shape Perception Model for Shape-Changing Handheld Controllers Bridged by Inertial Tensor ( Honorable Mention Award)
Chaeyong Park, Jeongwoo Kim, and Seungmoon Choi.
In Proceedings of the ACM conference on Human Factors in Computing Systems (Hamburg, Germany, April 23-28, 2023). CHI’23. ACM (Accepted)
Intrinsically Synchronized Flexible Visuo-Haptic Device Operated by Single External Electric Field
Gilwoon Lee*, Chaeyong Park*, Doowon Park, Seungmoon Choi, and Unyong Jeong. (*equal contribution)
In Advanced Optical Materials. vol. 11, no. 7, 2202515. 2023 (IF=10.050)
Vibration-Augmented Buttons: Information Transmission Capacity and Application to Interaction Design
Chaeyong Park, Jeongwoo Kim, Dong-Geun Kim, Seungjae Oh, and Seungmoon Choi.
In Proceedings of the ACM conference on Human Factors in Computing Systems (New Orleans, USA, April 30-May 06, 2022). CHI’22. ACM